Search
Home >> Products >> Screeds, Levelling Compounds and Repair Mortars >> Levelling Compounds >> PCI STS 35 - Non Sag Levelling Compound

PCI NON SAG LEVELLING COMPOUND STS 35 

Fields of Application

  For indoor use.

  Levelling of hollows, holes, irregularities in the substrate and for angled smoothing work on

    - cementitious substrates

    - anhydrite screeds

    - mastic asphalt screeds

    - chipboards

    - timber floors.

  For the repair of treads and risers.

  For layer thicknesses from 0.5 to 50 mm.

Features and Benefits

  Very low emission, GEV-EMICODE EC 1.
  Low in chromates according to the German standard TRGS 613; Giscode ZP 1.

  Stiff plastic consistency, non sag.

  Rapid curing, walkable after approx. 45 minutes.
  Suitable for underfloor heating.
  Suitable for exposure to chair castors at a layer thickness of min. 1 mm.

Packaging

  25 kg PE lined heavy duty paper bag

  MSDS
  TDS
NBS Contact 

Project specifications available, please call:

0161 794 7411

Product Packaging 

DisclaimerCreditsCopyright 2008 BASF SE
V: 1.0.0.28075 - S:37 T:06/01/2009 16:42:01