PCI SSP 33 - Rapid Levelling Compound  

A fast-track product for indoor use smoothing and levelling floors before installing textile and resilient floorings. SSP 33 is suitable for cementitious substrates, anhydrite and magnesite screeds and non-absorbent substrates such as ceramic tiles. Suitable for use with underfloor heating and for exposure to chair castors at a depth of 1mm.


Features & Benefits

	For layer thicknesses from 0.5 to 5 mm
	Very low emission
	Low in chromates
	Self levelling
	Walkable after approx. 2 hours
	Grindable after approx. 3 hours

25 kg PE lined heavy duty paper sack