PCI STL 39 - Non Sag Repair Compound Light 

For indoor use before installing textile and resilient floor coverings or parquet or laminate flooring to be bonded. Suitable for levelling hollows, holes and irregularities in the substrate and for angled smoothing work on cementitious substrates, anhydrite and mastic asphalt screeds, chipboard, OSB boards and timber floors. Can be used to repair treads and risers. Suitable for underfloor heating and for exposure to chair castors at a layer thickness of minimum 1mm.


Features & Benefits

	For layer thicknesses from 0.5 - 50 mm
	Very low emission
	Low in chromates
	Plastic consistency, non sag
	Rapid curing
	Grindable and walkable after approx. 1 hour
	Low consumption, only approx. 1.2 kg/m2 and mm layer thickness

20 kg PE lined heavy duty paper sack