PCI BSP - 42 Fine and Rapid Levelling 

For indoor use before laying textile and resilient floorings or parquet/laminate flooring to be bonded. Ideal for rapid levelling of hollows, holes and irregularities in the substrate and for angled smoothing work on cementitious substrates, anhydrite/mastic asphalt screeds, chipboards and timber floors. Suitable for underfloor heating and for exposure to chair castors at a layer thickness of minimum 1mm.


Features & Benefits

	For layer thicknesses from 0 - 5 mm for flat-surface levelling work
	Very low emission
	Low in chromates
	Stiff plastic consistency, non sag
	Very Rapid curing
	Walkable after approx. 15 minutes

5 kg PE lined heavy duty paper sack